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OpenPack: A Large-scale Dataset for Recognizing Packaging Works in IoT-enabled Logistic Environments

Authors Naoya Yoshimura Jaime Morales Takuya Maekawa Takahiro Hara
Book Proceedings of IEEE International Conference on Pervasive Computing and Communications
Published 2024 . 03
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Fund JSPS KAKENHI Grant Number JP21H03428, JP21H05299, and JP21J10059, JST ACT-X JPMJAX200T
DOI -
URL -
Bibtex
@inproceedings{id_10242,
  title     = {OpenPack: A Large-scale Dataset for Recognizing Packaging Works in IoT-enabled Logistic Environments},
  author    = {Yoshimura, Naoya and Morales, Jaime and Maekawa, Takuya and Hara, Takahiro},
  booktitle = {Proceedings of IEEE International Conference on Pervasive Computing and Communications},
  month     = {3},
  year      = {2024},
}
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